IAG-800 is specially formulated immersion silver process, which is suitable for lead-free soldering application. It can solve the common problem of Creeping Corrosion and silver tarnishing. This technology has a special post-treatment agent PAG-880, which can effectively eliminate Creeping Corrosion and silver tarnishing in subsequent assembly process.

Process characteristics
• High first pass yield with excellent solderability and reliability.
• Compliance with Rohs, WEEE and Lead free regulation.
• High anti-tarnish capability, no creep corrosion.
• Low ionic contamination, low resistance and meet HDI requirement.
• Compatible with most of brands soldermask without any attack.
• Meet BMV (Blind Micro Via) demanding, low energy consuming and user friendship green product.


Process characteristics
• High stability and long bath life
• Easily active nickel working bath.
• Fast nickel deposition rate.
• Stable nickel deposition.
• High hardness and good wear resistance.
• Bright nickel-plated surface.
• Self adjusting pH system
• High impurity tolerance of Immersion gold working bath.
• Uniform and bright gold appearance throughout the entire operation MTO of Immersion gold bath
• High nickel ion contamination resistance in Immersion gold bath (0.5-1.0 g/L).
• High deposition rate and high gold purity within operation window.
• Good thermal resistance, high adhesion and excellent solderability
• Low cost ownership

Reliability testing result
• Excellent solderability even after 6 times lead-free IR reflow.
• High solder joint strength to secure good reliability
• Good solderability for lead free application, suitable for every assembly process.